データテーブル イメージ 製造元。セクション # ストック 価格 はかる Packaging Series Product Status Type Number of Positions or Pins ( Grid ) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material
20-3518-10

データテーブル

20-3518-10

20-3518-10

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3690 2.05
- +

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Tube 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
A-CCS 068-Z-T

データテーブル

A-CCS 068-Z-T

A-CCS 068-Z-T

CONN SOCKET PLCC 68POS TIN

Assmann WSW Components

6819 2.07
- +

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Tube - Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polybutylene Terephthalate (PBT)
111-43-314-41-001000

データテーブル

111-43-314-41-001000

111-43-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

8104 2.09
- +

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Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-1-28-006

データテーブル

210-1-28-006

210-1-28-006

CONN IC DIP SOCKET 28POS GOLD

CNC Tech

1555 2.10
- +

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Tube - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
940-44-032-24-000000

データテーブル

940-44-032-24-000000

940-44-032-24-000000

CONN SOCKET PLCC 32POS TIN

Mill-Max Manufacturing Corp.

4426 2.11
- +

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Tube 940 Active PLCC 32 (2 x 7, 2 x 9) 0.100 (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
AR 40-HZL-TT

データテーブル

AR 40-HZL-TT

AR 40-HZL-TT

CONN IC DIP SOCKET 40POS TIN

Assmann WSW Components

8409 2.12
- +

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Tube - Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
1-1814655-1

データテーブル

1-1814655-1

1-1814655-1

CONN SOCKET SIP 16POS GOLD

TE Connectivity AMP Connectors

4371 2.12
- +

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Bulk - Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester
8444-21B1-RK-TP

データテーブル

8444-21B1-RK-TP

8444-21B1-RK-TP

CONN SOCKET PLCC 44POS TIN

3M

3496 2.14
- +

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今すぐ検索

Tube 8400 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
940-44-028-24-000000

データテーブル

940-44-028-24-000000

940-44-028-24-000000

CONN SOCKET PLCC 28POS TIN

Mill-Max Manufacturing Corp.

2544 2.19
- +

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今すぐ検索

Tube 940 Active PLCC 28 (4 x 7) 0.100 (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
AR 20-HZW/TN

データテーブル

AR 20-HZW/TN

AR 20-HZW/TN

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

3167 2.21
- +

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今すぐ検索

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
4601

データテーブル

4601

4601

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

2207 2.26
- +

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今すぐ検索

Bulk - Active Transistor, TO-3 3 (Oval) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled
18-3518-10

データテーブル

18-3518-10

18-3518-10

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

1152 2.29
- +

カートに追加

今すぐ検索

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
A-CCS 084-Z-T

データテーブル

A-CCS 084-Z-T

A-CCS 084-Z-T

IC PLCC SOCKET 84POS TIN

Assmann WSW Components

1646 2.31
- +

カートに追加

今すぐ検索

Tube - Active PLCC 84 (4 x 21) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polybutylene Terephthalate (PBT)
8452-21B1-RK-TP

データテーブル

8452-21B1-RK-TP

8452-21B1-RK-TP

CONN SOCKET PLCC 52POS TIN

3M

1113 2.35
- +

カートに追加

今すぐ検索

Tube 8400 Active PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
A-CCS 032-G-T

データテーブル

A-CCS 032-G-T

A-CCS 032-G-T

CONN SOCKET PLCC 32POS GOLD

Assmann WSW Components

1480 2.36
- +

カートに追加

今すぐ検索

Tube - Active PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT)
8468-21B1-RK-TR

データテーブル

8468-21B1-RK-TR

8468-21B1-RK-TR

CONN SOCKET PLCC 68POS TIN

3M

1474 2.99
- +

カートに追加

今すぐ検索

Tape & Reel (TR),Cut Tape (CT),Digi-Reel® 8400 Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
8452-11B1-RK-TP

データテーブル

8452-11B1-RK-TP

8452-11B1-RK-TP

CONN SOCKET PLCC 52POS TIN

3M

3723 2.40
- +

カートに追加

今すぐ検索

Tube 8400 Active PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
214-44-320-01-670800

データテーブル

214-44-320-01-670800

214-44-320-01-670800

CONN IC DIP SOCKET 20POS TIN

Mill-Max Manufacturing Corp.

1268 2.40
- +

カートに追加

今すぐ検索

Tube 214 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-87-628-41-001151 110-87-628-41-001151

110-87-628-41-001151

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

1218 1.92
- +

カートに追加

今すぐ検索

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 14-HZL/07-TT

データテーブル

AR 14-HZL/07-TT

AR 14-HZL/07-TT

CONN IC DIP SOCKET 14POS GOLD

Assmann WSW Components

3145 2.52
- +

カートに追加

今すぐ検索

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
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