データテーブル イメージ 製造元。セクション # ストック 価格 はかる Packaging Series Product Status Type Number of Positions or Pins ( Grid ) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material
D2824-42

データテーブル

D2824-42

D2824-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

2780 2.66
- +

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Tube D2 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
AR 28-HZL/01-TT

データテーブル

AR 28-HZL/01-TT

AR 28-HZL/01-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

1148 2.66
- +

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Tube - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
4591

データテーブル

4591

4591

CONN TRANSIST TO-5 4POS TIN

Keystone Electronics

2132 2.68
- +

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Bulk - Active Transistor, TO-5 4 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled
AR 16-HZL/07-TT

データテーブル

AR 16-HZL/07-TT

AR 16-HZL/07-TT

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

1976 2.71
- +

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Tube - Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
111-43-320-41-001000

データテーブル

111-43-320-41-001000

111-43-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

212 2.71
- +

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今すぐ検索

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-43-210-41-005000

データテーブル

917-43-210-41-005000

917-43-210-41-005000

CONN SOCKET TRANSIST TO100 10POS

Mill-Max Manufacturing Corp.

168 2.73
- +

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今すぐ検索

Tube 917 Active Transistor, TO-100 10 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-87-314-41-001101

データテーブル

123-87-314-41-001101

123-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

1064 1.85
- +

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今すぐ検索

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-43-624-41-001000

データテーブル

115-43-624-41-001000

115-43-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

133 2.96
- +

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今すぐ検索

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
214-44-628-01-670800

データテーブル

214-44-628-01-670800

214-44-628-01-670800

CONN IC DIP SOCKET 28POS TIN

Mill-Max Manufacturing Corp.

219 2.99
- +

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今すぐ検索

Tube 214 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
382

データテーブル

382

382

CONN IC DIP SOCKET 28POS

Adafruit Industries LLC

2998 3.00
- +

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今すぐ検索

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) - - - - - - - - - - - -
XR2C-2011-N

データテーブル

XR2C-2011-N

XR2C-2011-N

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

612 3.06
- +

カートに追加

今すぐ検索

Bulk XR2 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
D2928-42

データテーブル

D2928-42

D2928-42

CONN IC DIP SOCKET 28POS GOLD

Harwin Inc.

165 3.11
- +

カートに追加

今すぐ検索

Tube D2 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
210-93-632-41-001000

データテーブル

210-93-632-41-001000

210-93-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

345 3.12
- +

カートに追加

今すぐ検索

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-43-632-41-001000

データテーブル

210-43-632-41-001000

210-43-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

2346 3.12
- +

カートに追加

今すぐ検索

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-87-328-41-134161

データテーブル

114-87-328-41-134161

114-87-328-41-134161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3775 2.10
- +

カートに追加

今すぐ検索

Box 114 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-43-328-41-003000

データテーブル

115-43-328-41-003000

115-43-328-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

251 3.26
- +

カートに追加

今すぐ検索

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
22-4518-10

データテーブル

22-4518-10

22-4518-10

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2042 3.28
- +

カートに追加

今すぐ検索

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-93-628-41-003000

データテーブル

115-93-628-41-003000

115-93-628-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

209 3.32
- +

カートに追加

今すぐ検索

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-328-41-003000

データテーブル

115-93-328-41-003000

115-93-328-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

137 3.32
- +

カートに追加

今すぐ検索

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6518-10

データテーブル

32-6518-10

32-6518-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

889 3.36
- +

カートに追加

今すぐ検索

Tube 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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