うんぱん馬車 ( )| データテーブル | イメージ | 製造元。セクション # | ストック | 価格 | はかる | Packaging | Series | Product Status | Type | Number of Positions or Pins ( Grid ) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
データテーブル |
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1-2324271-3RIGHT SEGMEN LGA4189-4 SOCKET-P4 |
5113 | 29.22 |
カートに追加今すぐ検索 |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
データテーブル |
|
1-2324271-4LEFT SEGMEN LGA4189-4 SOCKET-P4 |
4833 | 29.22 |
カートに追加今すぐ検索 |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
データテーブル |
|
2-2129710-5CONN SOCKET LGA 3647POS GOLD |
654 | 35.76 |
カートに追加今すぐ検索 |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
データテーブル |
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2-2129710-6CONN SOCKET LGA 3647POS GOLD |
1188 | 35.88 |
カートに追加今すぐ検索 |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
データテーブル |
|
1-2199298-1CONN IC DIP SOCKET 6POS TIN |
20188 | 0.26 |
カートに追加今すぐ検索 |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
データテーブル |
|
1-2199298-2CONN IC DIP SOCKET 8POS TIN |
8365 | 0.28 |
カートに追加今すぐ検索 |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
データテーブル |
|
1-2199298-3CONN IC DIP SOCKET 14POS TIN |
2379 | 0.28 |
カートに追加今すぐ検索 |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
データテーブル |
|
1-2199298-4CONN IC DIP SOCKET 16POS TIN |
4836 | 0.32 |
カートに追加今すぐ検索 |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
データテーブル |
|
1-2199298-5CONN IC DIP SOCKET 18POS TIN |
4654 | 0.39 |
カートに追加今すぐ検索 |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
データテーブル |
|
1-2199298-6CONN IC DIP SOCKET 20POS TIN |
6422 | 0.59 |
カートに追加今すぐ検索 |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
RFQ
