データテーブル | イメージ | 製造元。セクション # | ストック | 価格 | はかる | Packaging | Series | Product Status | Type | Number of Positions or Pins ( Grid ) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material |
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SA163000CONN IC DIP SOCKET 16POS GOLD |
14814 | 0.75 |
カートに追加今すぐ検索 |
Tube | SA | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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ED14DTCONN IC DIP SOCKET 14POS TIN |
10734 | 0.19 |
カートに追加今すぐ検索 |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
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ED08DTCONN IC DIP SOCKET 8POS TIN |
20498 | 0.21 |
カートに追加今すぐ検索 |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
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ED18DTCONN IC DIP SOCKET 18POS TIN |
5808 | 0.22 |
カートに追加今すぐ検索 |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
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ED06DTCONN IC DIP SOCKET 6POS TIN |
1491 | 0.24 |
カートに追加今すぐ検索 |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
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ED16DTCONN IC DIP SOCKET 16POS TIN |
10129 | 0.26 |
カートに追加今すぐ検索 |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
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ED24DTCONN IC DIP SOCKET 24POS TIN |
5374 | 0.28 |
カートに追加今すぐ検索 |
Tube | ED | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
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ED20DTCONN IC DIP SOCKET 20POS TIN |
51504 | 0.31 |
カートに追加今すぐ検索 |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
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ED28DTCONN IC DIP SOCKET 28POS TIN |
10281 | 0.34 |
カートに追加今すぐ検索 |
Tube | ED | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
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ED241DTCONN IC DIP SOCKET 24POS TIN |
14927 | 0.35 |
カートに追加今すぐ検索 |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |