うんぱん馬車 ( )| データテーブル | イメージ | 製造元。セクション # | ストック | 価格 | はかる | Packaging | Series | Product Status | Type | Number of Positions or Pins ( Grid ) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material |
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データテーブル |
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SA286000CONN IC DIP SOCKET 28POS GOLD |
912 | 1.32 |
カートに追加今すぐ検索 |
Tube | SA | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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データテーブル |
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SA283040CONN IC DIP SOCKET 28POS GOLD |
422 | 1.39 |
カートに追加今すぐ検索 |
Tube | SA | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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データテーブル |
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SA326000CONN IC DIP SOCKET 32POS GOLD |
317 | 1.40 |
カートに追加今すぐ検索 |
Tube | SA | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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データテーブル |
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SA406040CONN IC DIP SOCKET 40POS GOLD |
185 | 1.99 |
カートに追加今すぐ検索 |
Tube | SA | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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データテーブル |
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SA183040CONN IC DIP SOCKET 18POS GOLD |
3568 | 0.96 |
カートに追加今すぐ検索 |
Tube | SA | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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データテーブル |
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SA486000CONN IC DIP SOCKET 48POS GOLD |
3315 | 2.10 |
カートに追加今すぐ検索 |
Tube | SA | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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データテーブル |
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EDO-32PLCZSMCONN SOCKET PLCC 32POS |
518 | 0.73 |
カートに追加今すぐ検索 |
Tube | ED | Active | PLCC | 32 (2 x 16) | 0.050 (1.27mm) | - | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | - | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
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データテーブル |
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SA486040CONN IC DIP SOCKET 48POS GOLD |
2755 | 2.38 |
カートに追加今すぐ検索 |
Tube | SA | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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データテーブル |
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BU14OZ-178-HTCONN IC DIP SOCKET 14POS GOLD |
2422 | 1.47 |
カートに追加今すぐ検索 |
Tube | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
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データテーブル |
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BU080Z-178-HTCONN IC DIP SOCKET 8POS GOLD |
3091 | 2.15 |
カートに追加今すぐ検索 |
Tube | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
RFQ
