うんぱん馬車 ( )| データテーブル | イメージ | 製造元。セクション # | ストック | 価格 | はかる | Packaging | Series | Product Status | Type | Number of Positions or Pins ( Grid ) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
データテーブル |
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BU280Z-178-HTCONN IC DIP SOCKET 28POS GOLD |
3952 | 2.89 |
カートに追加今すぐ検索 |
Tube | BU-178HT | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
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データテーブル |
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BU060Z-178-HTCONN IC DIP SOCKET 6POS GOLD |
2900 | 0.00 |
カートに追加今すぐ検索 |
Tube | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
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データテーブル |
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BU160Z-178-HTCONN IC DIP SOCKET 16POS GOLD |
2769 | 0.00 |
カートに追加今すぐ検索 |
Tube | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
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データテーブル |
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BU180Z-178-HTCONN IC DIP SOCKET 18POS GOLD |
3143 | 0.00 |
カートに追加今すぐ検索 |
Tube | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
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データテーブル |
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BU200Z-178-HTCONN IC DIP SOCKET 20POS GOLD |
3410 | 0.00 |
カートに追加今すぐ検索 |
Bulk | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
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データテーブル |
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BU240Z-178-HTCONN IC DIP SOCKET 24POS GOLD |
3619 | 0.00 |
カートに追加今すぐ検索 |
Tube | BU-178HT | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
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データテーブル |
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BU400Z-178-HTCONN IC DIP SOCKET 40POS GOLD |
3865 | 0.00 |
カートに追加今すぐ検索 |
Tube | BU-178HT | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
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データテーブル |
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BU480Z-178-HTCONN IC DIP SOCKET 48POS GOLD |
2467 | 0.00 |
カートに追加今すぐ検索 |
Tube | BU-178HT | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
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データテーブル |
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BU640Z-178-HTCONN IC DIP SOCKET 64POS GOLD |
2743 | 0.00 |
カートに追加今すぐ検索 |
Tube | BU-178HT | Obsolete | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
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データテーブル |
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WMS-060ZCONN IC DIP SOCKET 6POS GOLD |
2793 | 0.00 |
カートに追加今すぐ検索 |
Tube | WMS | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
RFQ
